Three-dimensional Integrated Circuit Market explores New Growth Opportunities by 2016-2024

Three-dimensional Integrated Circuit Market

Three-dimensional Integrated Circuit Market

Zion Market Research, the market research group announced the analysis report titled  ‘Three-dimensional Integrated Circuit Market: Global Industry Analysis, Size, Share, Growth, Trends, and Forecasts 2016–2024’

Three-dimensional Integrated Circuit Market: Overview

Three-dimensional integrated circuit(3D IC) comes under the branch of microelectronics; it is an integrated circuit which is produced by the stacking silicon wafers and dies and they are vertically interconnected using through-silicon vias. They now act as single device giving better performance at minimum power usage and smaller footprint than the traditional 2D processes. The 3D IC packaging has benefits if not of the same level but does not compromise on the form factor

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Three-dimensional Integrated Circuit Market: Segmentation

The three-dimensional integrated circuit global market is segmented into its technology, application, end user industry, and geography. On the basis of the packaging technology, the three-dimensional integrated circuit market is divided into 2.5D, 3D wafer level chip-scale packaging and 3D TSV. Based on the application the three-dimensional integrated circuit market is categorized into imaging and optoelectronics, MEMS/sensors, power, RF, logic, memory, LED, analog and mixed signal and photonics. The various end-user industries where the three-dimensional integrated circuit is used include telecommunication, automotive, smart technologies, consumer electronics, industrial sector, military and aerospace and medical devices. Region-wise, the three-dimensional integrated circuit market is diversified into Europe, North America, Asia-Pacific and Rest of the World.

Three-dimensional Integrated Circuit Market: Growth Factors

The prime factor that is boosting the three-dimensional integrated circuit market growth is the high proliferation of the IoT devices. The manufacturers in the market of IoT are constantly updating their designs, packaging and the manufacturing concepts in order to gain momentum in the three-dimensional integrated circuit market. Thus they are constantly manufacturing new updated products from different sectors such as manufacturing, consumer electronics, and healthcare. To increase the returns of the organizations by enabling predictive maintenance, by streamlining the process and increasing the productivity 3D MEMS and the sensors are used in order to capture the data in the real time. This, in turn, reduces the chances of reducing the maintenance cost and any chance of suddenly stopping the work due to reasons such as machinery failure. Different technological advances such as 3D NAND, tablet PCs, automotive products and DDR4 DRAM, consumer electronics have the large capacity of storage and they have low power consumption; these advancements use three-dimensional integrated circuit thus driving the growth of the market. The factors that hamper the market growth is the high cost and the utilization of the SOI wafer on large scale.

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Three-dimensional Integrated Circuit Market: Regional Analysis

The three-dimensional integrated circuit market is growing in the Asia-Pacific region. This is majorly owing to the existence of major companies such as Samsung, United Microelectronics Corporation, etc. in the region. There are many more companies that are present in the region which addresses the issues associated with the manufacturing of the three-dimensional integrated circuit in a cost effective manner. The other regions such as North America and Europe also contribute their share in the three-dimensional integrated circuit market growth.

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Three-dimensional Integrated Circuit Market: Competitive Players

The major market players in the three-dimensional integrated circuit include Samsung, Taiwan Semiconductors Manufacturing (TSMC), Intel, SanDisk, STATS ChipPAC, Xilinx, Advanced Semiconductor Engineering (ASE), STMicroelectronics, Toshiba, Micron, SK Hynix and United Microelectronics.

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