Global Thin Wafer Processing and Dicing Equipment Market: Despite Continued Usage of Blade Dicing, Laser Dicing to Emerge More Lucrative

Global Thin Wafer Processing and Dicing Equipment Market: Overview

Rising demand for three dimensional integrated circuit used extensively across various miniature semiconductor devices is one of the important factor anticipated to boost the demand for thin wafer processing and dicing equipment in the coming years. Three dimensional integrated circuit are increasingly adopted across various space constrained applications including portable consumer electronic devices, sensors, MEMS and industrial products as it increases the overall performance of the products in terms of speed, durability, low power consumption, light weight and memory.

Moreover, three dimensional integrated circuit also helps to reduce the area of consumption in a printed circuit board and in turn enables extensive cost reduction. Thin wafer of thickness 20 um – 50 um is an integral part of the three dimensional integrated circuit technology. Thus, anticipated increasing demand for three dimensional integrated circuit in turn is predicted to boost the demand for thin wafer processing equipment during the forecast period from 2016 to 2024.

Obtain Report Details @
http://www.transparencymarketresearch.com/thin-wafer-processing-dicing-equipment-market.html

Global Thin Wafer Processing and Dicing Equipment Market: Segmentation

For the purpose of providing an exhaustive analysis of the thin wafer processing and dicing equipment market across the globe, the market has been segmented on the basis of application, dicing technology, wafer size and geography. Thin wafer finds are used extensively across various application sectors including logic and memory, MEMS (Micro Electro Mechanical Systems), power device, RFID (Radio Frequency Identification) and CMOS image sensor. Moreover, different technology used in the process of dicing thin wafer including blade dicing, laser dicing and plasma dicing is also covered within our scope of research.

Different laser dicing procedure such as laser ablation and stealth dicing has also been considered to track the market estimate of laser dicing technology. In addition, different application and dicing technology segment has been further classified on the basis of wafer thickness such as 750 ?m, 120 ?m and 50 ?m. Furthermore, information relating to the current market trend and future expected market growth of the application, technology and wafer thickness segment across different regions including Asia Pacific, North America, Europe, Middle-East and Africa (MEA) and Latin America is also provided within the report.

Make an Enquiry @
http://www.transparencymarketresearch.com/sample/sample.php?flag=B&rep_id=15611

Global Thin Wafer Processing and Dicing Equipment Market: Snapshot

The recent increase in the demand for portable communication devices, such as smartphones, memory cards, smart card, and various computing devices has boosted the global market for thin wafer processing and dicing equipment substantially. In 2015, the global market for thin wafer processing and dicing equipment garnered US$388.9 mn in revenues, which, with an expected CAGR of 6.80% between 2016 and 2024, is likely to increase to US$692.5 mn by the end of 2024.

The rising awareness about the attributes and benefits of thin wafer processing and dicing equipment, such as better electrical performance and reduced production cost of the device, is likely to support the growth of this market significantly over the next few years.

About Us

Transparency Market Research (TMR) is a market intelligence company, providing global business information reports and services. Our exclusive blend of quantitative forecasting and trends analysis provides forward-looking insight for thousands of decision makers. We have an experienced team of Analysts, Researchers, and Consultants, who us e proprietary data sources and various tools and techniques to gather, and analyze information. Our business offerings represent the latest and the most reliable information indispensable for businesses to sustain a competitive edge.

Each TMR Syndicated Research report covers a different sector – such as pharmaceuticals, chemical, energy, food & beverages, semiconductors, med-devices, consumer goods and technology. These reports provide in-depth analysis and deep segmentation to possible micro levels. With wider scope and stratified research methodology, our syndicated reports thrive to provide clients to serve their overall research requirement.

Contact

Transparency Market Research
90 State Street, Suite 700
Albany, NY 12207
Tel: +1-518-618-1030
USA – Canada Toll Free: 866-552-3453
Email: sales@transparencymarketresearch.com
Website: http://www.transparencymarketresearch.com
Browse market research blog: https://tmrresearch.blogspot.com/

%d bloggers like this: