Global Copper Clad Laminate (CCL) Market Research Report 2016 Industry Growth, Trends, Regions, Demand and Analysis 2021


This report provides detailed analysis of worldwide markets for Copper Clad Laminate (CCL) from 2011-2016, and provides extensive market forecasts (2016-2021) by region/country and subsectors. It covers the key technological and market trends in the Copper Clad Laminate (CCL) market and further lays out an analysis of the factors influencing the supply/demand for Copper Clad Laminate (CCL), and the opportunities/challenges faced by industry participants. It also acts as an essential tool to companies active across the value chain and to the new entrants by enabling them to capitalize the opportunities and develop business strategies.

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Copper-clad laminates, key materials for making printed circuit boards (PCBs). It can apply for consumer, computer, LCD, communication, automotive, aerospace, medicine and defense application. All copper-clad laminates are available with rolled, annealed copper or electro-deposited copper. In addition, both types are available with double-treated copper (nodules of electro-deposited copper on both sides of the copper foil). Double-treated copper, if used, eliminates surface preparation steps prior to resist or coverlay lamination. No matter how the board will develop thinner and lighter, it starts from copper clad lamination. Production of copper clad laminates, involves bulk chemical polymerization and, often, solvent based glues to bind copper foil to the laminate. This process is potentially one of the most noxious processes in PWB manufacturing in terms of solvent emissions.

GCC’s report, Global Copper Clad Laminate (CCL) Market Outlook 2016-2021, has been prepared based on the synthesis, analysis, and interpretation of information about the global Copper Clad Laminate (CCL) market collected from specialized sources. The report covers key technological developments in the recent times and profiles leading players in the market and analyzes their key strategies. The competitive landscape section of the report provides a clear insight into the market share analysis of key industry players. The major players in the global Copper Clad Laminate (CCL) market areIsola (USA), Park Electrochemical (USA), Arlon (USA), Rogers Corporation (USA), Panasonic (Japan), Sumitomo Bakelite (Japan), Hitachi Chemical (Japan), Mitsubishi Gas Chemical (Japan), Doosan Electronics (Korea), Nan Ya Plastics (Taiwan), Chang Chun Plastics (Taiwan), Taiwan Union Technology (Taiwan), ITEQ (Taiwan), Elite Material (Taiwan), Grace Electron (China), Kingboard Laminates Group (China), Chaohua Tech (China), Shengyi Technology (China), Shanghai Jinanguoji (China), Zhejiang Huazheng (China), Shandong Jinbao (China), Guangdong Goworld (China).

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The report provides separate comprehensive analytics for the North America, Europe, Asia-Pacific, Middle East and Africa and Rest of World. In this sector, global competitive landscape and supply/demand pattern of Copper Clad Laminate (CCL) industry has been provided.

Table of Contents

Part 1. Scope of Report
1.1 Research Methodology
1.2 Geographic Scope
1.3 Years Considered

Part 2. Introduction
2.1 Key Findings
2.2 Value Chain Analysis
2.2.2 Upstream
2.2.3 Downstream

Part 3. Manufacture
3.1 Manufacturing Process
3.2 Issues and Trends

Part 4. Cost Structure
4.1 Bill of Materials
4.2 Labor Cost
4.3 Depreciation Cost
4.4 Manufacturing Cost

Part 5. Worldwide Key Vendors
5.1 Profile
5.2 Financial Performance
5.3 Market Share Trends..

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