Focus On Electronic Adhesives Market and Industry Development Research Report 2014 to 2021
The Electronic Adhesives Market Research Report provides forecast and estimates for each application in terms of Market Size, Share, Trend and Growth during the study period (2014–2021).
Electronic adhesives are the binding materials used in the assembly and enduring operations of electronic products. Epoxies, polyurethanes, acrylics and silicones are the major material types used in the manufacturing of global electronic adhesives market. The products are based on its properties such as electrical conductivity, thermal conductivity, UV curing, and others.
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Electrical conductivity adhesives dominate the global electronic adhesives market followed thermal conductivity adhesives. These products witness growth owing to execution as substitute to tin-lead solders. UV curing is the fastest growing segment for the forecasted period. Surface mount devices, potting and encapsulation, conformal coatings and others are the leading applications of electronic adhesives.
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Product innovation, technological breakthrough and safety regulations are the driving factor for the growth of the global electronic adhesives market. Investment in installation has huge cost and expenses to the manufacturers. This leads to high cost of electronic products. Hence, these constrains shrink the growth of this market. Potential growth and opportunities from industries like aircrafts, automotive and imaging devices are expected to benefit the global electronic adhesives market.
Major players assessed in the report are :
In terms of demand, Asia Pacific dominates the global electronic adhesives market followed by North America and Europe. Japan, China and India are aiding the growth of electronic adhesives in this region. North America and Europe are matured geographies that are hindering the growth of electronic adhesives in the market worldwide.
Leading companies in the global electronic adhesives market include 3M Company, American Chemical Inc., Ashland Inc., Avery Dennison Corporation, BASF SE, Beardow & Adams Ltd., Bostik Inc., Dymax Corporation, Dai Nippon Printing Co. Ltd., Evonik Industries AG, H.B. Fuller, Henkel AG & Company, Huntsman Corporation KGaA, Hitachi Chemicals, Indium Corporation, Jowat AG, Kyocera Chemical Corporation, LG Chemical Ltd., Mitsui Chemicals, Inc., Nordson Corporation, Sika AG and The Dow Chemical Co.
SEGMENTATIONS IN REPORT :
1. Electronic Adhesives By Product Types :
– Electrically Conductive Adhesives
– Thermally Conductive Adhesives
– UV Curing Adhesives
2. Electronic Adhesives By Material Types :
3. Electronic Adhesives By Applications :
– Surface Mount Devices
– Potting And Encapsulation
– Conformal Coatings
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